Yesterday, TSMC unveiled its next cutting-edge logic process technology, A14, at the Company’s North America Technology Symposium.
Representing a significant advancement from TSMC’s industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency.
Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.
Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density.
Leveraging the Company’s experience in design-technology co-optimisation for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency and design flexibility.
“Our customers constantly look to the future, and TSMC’s technology leadership and manufacturing excellence provides them with a dependable roadmap for their innovations,” said TSMC Chairman and CEO Dr. C.C. Wei. “TSMC’s cutting-edge logic technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds to unleash our customers’ innovation for advancing the AI future.”
