ACDA (Advanced Chip Design Accelerator) will be based at the Innovation Park Artificial Intelligence, in Heilbronn, north of Stuttgart.
Part of Imec’s automotive chiplet program, it will develop chiplets, packaging, sensing and edge AI technology.
“By adding this complementary expertise to Imec’s existing automotive R&D offering, the competence center will be able to better support the local and international automotive industry in de-risking and accelerating the introduction of automotive chiplets into manufacturing,” according to Imec.
€40m has been provided by the Baden-Württemberg ministry of economic affairs, labour and tourism, initially for five years, and the State of Baden-Württemberg is adding €5m for an office and scientific support from Fraunhofer-Gesellschaft.
“We are excited to bring our expertise and global partner network to the state of Baden-Württemberg, the cradle of the automotive industry in Germany,” said Imec president and CEO Luc Van den hove (photo left). “We also look forward to expanding our collaboration with Fraunhofer to leverage on our expertise and lay the foundation for future chiplet solutions. To realise the region’s ambitions, we will also focus on growing the talent pipeline across Europe by training engineers in collaboration with the local ecosystem, including universities.”
“High-performance chips are playing an important role for software-driven applications in core industries in Baden-Württemberg and are increasingly shaping mobility, artificial intelligence and digitalisation,” said Baden-Württemberg minister of economic affairs Nicole Hoffmeister-Kraut (photo right).
Baden-Württemberg and Flanders signed a memorandum of understanding on electronics cooperation last year.
