Hamamatsu Photonics is to  build  a new $260 million factory capable of processing 8000 eight inch equivalent wpm at its manufacturing site in Ichino-cho, Higashi-ku, Hamamatsu City  to boost its pre-processing stage production capacity.
The groundbreaking ceremony  will be held on Friday, June 30, 2023, and the building is scheduled for completion in June 2025.
The new factory will nearly double the company’s production space. Besides its current production lines for conventional 6-inch silicon wafers, Hammatsu will be running a production line compatible with 8-inch diameter wafers in the new factory building to ensure production continuity while also streamlining production and cutting costs.
The clean room will be connected to the existing factory building’s clean room via a clean passage. This will allow the quick and smooth movement of people and materials as well as automate the manufacturing process.Â
The building makes use of an earthquake-resistant structure for better resilience in responding to natural disasters and will also include eco-friendly manufacturing equipment.
The companyis also constructing another new factory building for the device post-processing stage at its  Shingai Factory site located in Shingai-cho, Minami-ku, Hamamatsu City.Â
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