ASE led the ranking with revenue of $18.54 billion with nearly a 45% share.
Amkor wasc second with $6.32 billion in revenue (-2.8% YoY).
JCET took third place with $5 billion in revenue (+19.3% YoY).
Fourth-ranked Tongfu Microelectronics recorded $3.32 billion  in revenue (+5.6% YoY).
Powertech Technology came in fifth with $2.28 billion revenue (+1% YoY).
Growth was limited by the absence of a significant rebound in memory packaging/testing and the ongoing transition phase in advanced packaging.
HT-Tech secured sixth place with $2.01B in revenue (+26% YoY), with the highest annual growth among the top ten OSATs. The company not only mass-produces low- and mid-end packaging but is also investing in high-end development, focusing on applications such as AI, HPC, automotive electronics, and memory, with a strong local customer base in China.
WiseRoad ranked seventh with $1.56B in revenue (+5% YoY). Growth was driven by recovering semiconductor demand and technological upgrades. Additionally, the retreat of some foreign competitors due to the U.S.-China tech conflict has allowed TFME to expand its domestic footprint.
Hana Micron ranked eighth with $920M in revenue (+23.7% YoY), supported by strong performance from its memory customers.
KYEC came in ninth with $910M in revenue (-14.5% YoY) mainly due to the sale of its subsidiary KLTech. That said, growing demand from AI servers and HPC chips continues to support KYEC’s testing business, alongside growing CoWoS testing demand.
ChipMOS rounded out the top ten with $710M in revenue (+3.1% YoY), with its driver IC business benefiting from steady demand in the automotive and OLED sectors.
TrendForce reports that the 2024 OSAT market reflects an ongoing restructuring of the semiconductor value chain. OSAT providers are facing increasingly stringent technological requirements from heterogeneous integration and wafer-level packaging (WLP) to die stacking, the adoption of advanced test equipment, and surging demand for high-frequency, high-density packaging driven by AI and edge computing. The industry is evolving from a traditional manufacturing model with a core strategic sector centered on advanced integration and R&D.
In summary, the global OSAT market in 2024 is defined by a dual dynamic: stable leadership from mature players and the rapid rise of regional challengers. This trend sets the state for intensified competition in next-generation technologies such as advanced packaging and heterogeneous integration
