AMD Instinct MI400 Spotted In Latest Patches, Will Feature Up To 8 Chiplets On Dual Interposer Dies

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AMD’s next-gen Instinct MI400 accelerators will bring separate interposer dies for up to 8 chaplets as spotted in the latest patches.

AMD Instinct MI400 Accelerators Will Utilize the CDNA Next Architecture and Will Have Eight XCDs and Dedicated Multimedia I/O Tiles

It appears that AMD’s next-gen Instinct MI400 accelerator will bring significant changes in the design, which reportedly comprise the inclusion of newer tiles. While AMD is still working on the MI350 for release this year, we have started getting information on the Instinct MI400, which is set to launch in 2026.

As per the latest reports, some of the design aspects of the MI400 have been revealed. AMD has yet to provide specs and design information on the MI400 in detail officially, but the latest patches give us a sneak peek into what you should be expecting in the upcoming accelerators.

As spotted by Coelacanth Dream, the new patches available on the Free Desktop show that the MI400 will feature up to Four XCDs (Accelerated Compute Dies), increasing the count from two XCDs per AID on the MI300. That said, there will be two AIDs (Active Interposer Dies) on the MI400 accelerator, and this time, there will be separate Multimedia and I/O dies as well.

Image Source: FreeDesktop.org

For each AID, there will be a dedicated MID tile, and this will offer efficient communication between the compute units and the I/O interfaces compared to what we had in previous generations. Even on the MI350, AMD uses infinity fabric for inter-die communication. So, it’s a big change to the MI400 accelerators, which are aimed at large-scale AI training and inference tasks and are going to be based on the CDNA-Next architecture which is probably going to be rebranded to UDNA as part of the red team’s unification strategy of the RDNA and CDNA architectures.

Image Source: AMD

Meanwhile, AMD is going to release the MI350 accelerators based on the CDNA 4 architecture this year, which already brings huge improvements over the MI300 and its predecessors. It brings the advanced 3nm process node, higher energy efficiency, and will offer up to a 35-fold increase in AI Inference compared to MI300. The details about the uplifts on MI400 are still unknown, and we await AMD’s announcement of its specs and features.

AMD Instinct AI Accelerators:

Accelerator Name AMD Instinct MI400 AMD Instinct MI350X AMD Instinct MI325X AMD Instinct MI300X AMD Instinct MI250X
GPU Architecture CDNA Next / UDNA CDNA 4 Aqua Vanjaram (CDNA 3) Aqua Vanjaram (CDNA 3) Aldebaran (CDNA 2)
GPU Process Node TBD 3nm 5nm+6nm 5nm+6nm 6nm
XCDs (Chiplets) 8 (MCM) 8 (MCM) 8 (MCM) 8 (MCM) 2 (MCM)
1 (Per Die)
GPU Cores TBD TBD 19,456 19,456 14,080
GPU Clock Speed TBD TBD 2100 MHz 2100 MHz 1700 MHz
INT8 Compute TBD TBD 2614 TOPS 2614 TOPS 383 TOPs
FP6/FP4 Compute TBD 9.2 PFLOPs N/A N/A N/A
FP8 Compute TBD 4.6 PFLOPs 2.6 PFLOPs 2.6 PFLOPs N/A
FP16 Compute TBD 2.3 PFLOPs 1.3 PFLOPs 1.3 PFLOPs 383 TFLOPs
FP32 Compute TBD TBD 163.4 TFLOPs 163.4 TFLOPs 95.7 TFLOPs
FP64 Compute TBD TBD 81.7 TFLOPs 81.7 TFLOPs 47.9 TFLOPs
VRAM TBD 288 HBM3e 256 GB HBM3e 192 GB HBM3 128 GB HBM2e
Infinity Cache TBD TBD 256 MB 256 MB N/A
Memory Clock TBD 8.0 Gbps? 5.9 Gbps 5.2 Gbps 3.2 Gbps
Memory Bus TBD 8192-bit 8192-bit 8192-bit 8192-bit
Memory Bandwidth TBD 8 TB/s 6.0 TB/s 5.3 TB/s 3.2 TB/s
Form Factor TBD OAM OAM OAM OAM
Cooling TBD Passive Cooling Passive Cooling Passive Cooling Passive Cooling
TDP (Max) TBD TBD 1000W 750W 560W

News Source: Videocardz



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